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Si60
Si60 Applications
| ||
Physical Properties | ||
Colour | Clear | |
Type | Simulates PC Durable, stiff, high clarity models | |
Mechanical Properties | ||
Test/ISO | ||
Hardness Shore A/D | 86D | |
Flexural Strength | 87 -101 (MPa) | ATSM D790 |
Flexural Modulus | 2,700 – 3,000 (MPa) | |
Tensile Modulus | 2,690 – 3,100 (MPa) | ATSM D638M |
Tensile Strength | 58 – 68 (MPa) | |
Impact Strength | 15 -25 J/m | ATSM D256A |
Elongation Break (%) | 5 – 13% | ATSM D638 |
Thermal & Scientific Properties | ||
Glass Transition Temperature | 58°C | DMA, E” |
Heat Deflection Temp (°C) | ATSM D648-98C | |
@0.46 MPa | 53-55°C | |
@1.81 MPa | 48-50°C | |
Co-efficient of Thermal Expansion | E831-00 | |
TMA (T<Tg, 0-40°C) | 71µ/m – °C | |
TMA (T<Tg, 75-140°C) | 153µ/m – °C |
Si60 Applications
| ||
Physical Properties | ||
Colour | Clear | |
Type | Simulates PC Durable, stiff, high clarity models | |
Mechanical Properties | ||
Hardness Shore A/D | 86D | |
Flexural Strength | 87 -101 (MPa) | Test/ISO: ATSM D790 |
Flexural Modulus | 2,700 – 3,000 (MPa) | Test/ISO: ATSM D790 |
Tensile Modulus | 2,690 – 3,100 (MPa) | Test/ISO: ATSM D638M |
Tensile Strength | 58 – 68 (MPa) | Test/ISO: ATSM D638M |
Impact Strength | 15 -25 J/m | Test/ISO: ATSM D256A |
Elongation Break (%) | 5 – 13% | Test/ISO: ATSM D638 |
Thermal & Scientific Properties | ||
Glass Transition Temperature | 58°C | Test/ISO: DMA, E” |
Heat Deflection Temp (°C) | Test/ISO: ATSM D648-98C | |
Heat Deflection Temp (°C) @0.46 MPa | 53-55°C | Test/ISO: ATSM D648-98C |
Heat Deflection Temp (°C) @1.81 MPa | 48-50°C | Test/ISO: ATSM D648-98C |
Co-efficient of Thermal Expansion TMA (T<Tg, 0-40°C) | 71µ/m – °C | Test/ISO: E831-00 |
Co-efficient of Thermal Expansion TMA (T<Tg, 75-140°C) | 153µ/m – °C | Test/ISO: E831-00 |
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