Si60

Si60 Datasheet - High Clarity Stereolithography material simulating PC

Si60 Applications

 

    • Tough functional prototypes
    • Automotive design components
    • Lighting components & consumer electronics
    • Medical instruments, devices and labware
    • Transparent assemblies & clear display/Fluid flow models
    • Patterns for Investment/Urethane castings
    • Concept & Marketing models
 Physical Properties
 ColourClear
 TypeSimulates PC
Durable, stiff, high clarity models
Mechanical Properties
 Test/ISO
Hardness Shore A/D 86D
Flexural Strength87 -101 (MPa) ATSM D790
Flexural Modulus2,700 – 3,000 (MPa)
Tensile Modulus 2,690 – 3,100 (MPa) ATSM D638M
Tensile Strength58 – 68 (MPa)
Impact Strength 15 -25 J/mATSM D256A
Elongation Break (%) 5 – 13% ATSM D638
   Thermal & Scientific Properties
Glass Transition Temperature 58°C DMA, E”
Heat Deflection Temp (°C) ATSM D648-98C
@0.46 MPa53-55°C
@1.81 MPa48-50°C
Co-efficient of Thermal Expansion E831-00
TMA (T<Tg, 0-40°C)71µ/m – °C
TMA (T<Tg, 75-140°C)153µ/m – °C

Si60 Applications

 

    • Tough functional prototypes
    • Automotive design components
    • Lighting components & consumer electronics
    • Medical instruments, devices and labware
    • Transparent assemblies & clear display/Fluid flow models
    • Patterns for Investment/Urethane castings
    • Concept & Marketing models
Physical Properties
ColourClear
TypeSimulates PC
Durable, stiff, high clarity models
Mechanical Properties
Hardness Shore A/D 86D
Flexural Strength87 -101 (MPa)Test/ISO: ATSM D790
Flexural Modulus2,700 – 3,000 (MPa)Test/ISO: ATSM D790
Tensile Modulus 2,690 – 3,100 (MPa)Test/ISO: ATSM D638M
Tensile Strength58 – 68 (MPa)Test/ISO: ATSM D638M
Impact Strength 15 -25 J/mTest/ISO: ATSM D256A
Elongation Break (%) 5 – 13%Test/ISO: ATSM D638
Thermal & Scientific Properties
Glass Transition Temperature 58°CTest/ISO: DMA, E”
Heat Deflection Temp (°C)Test/ISO: ATSM D648-98C
Heat Deflection Temp (°C) @0.46 MPa53-55°CTest/ISO: ATSM D648-98C
Heat Deflection Temp (°C) @1.81 MPa48-50°CTest/ISO: ATSM D648-98C
Co-efficient of Thermal Expansion TMA (T<Tg, 0-40°C)71µ/m – °CTest/ISO: E831-00
Co-efficient of Thermal Expansion TMA (T<Tg, 75-140°C)153µ/m – °CTest/ISO: E831-00

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