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LPE | Rapid Prototyping & Additive Manufacturing > Rapid Prototyping Services at LPE > Stereolithography > Stereolithography Materials > Watershed
Watershed
Watershed Applications
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| Physical Properties | ||
| Colour | Water Clear | |
| Type | Simulates ABS – Water Resistant |
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| Mechanical Properties | ||
| Test/ISO | ||
| Flexural Strength | 63.1 – 74.2 (MPa) | ATSM D790M |
| Flexural Modulus | 2,040 – 2,370 (MPa) | |
| Tensile Modulus | 2,650 – 2,880 (MPa) | ATSM D638M |
| Tensile Strength | 47.1 – 53.6 (MPa) | |
| Impact Strength | 0.2 – 0.3 J/m | ATSM D256A |
| Elongation Break (%) | 11-20% | ATSM D638M |
| Water Absorption | 0.35% | ASTM D570-98 |
| Thermal & Scientific Properties | ||
| Glass Transition Temperature | 39 – 46°C | E1545-00 |
| Heat Deflection Temp. (°C) | ATSM D648 | |
| @0.46 MPA | 45.9 – 54.5°C | |
| @1.81 MPA | 49 – 49.7°C | |
| Co-efficient of Thermal Expansion | ASTM E831-93 | |
| TMA (<Tg, -40 – 0°C) | 66 – 67 µm/m – °C | |
| TMA (T<Tg, 0- 50°C) | 90 – 96 µm/m – °C | |
| TMA (T<Tg, 50- 100°C) | 170 – 189 µm/m – °C | |
| TMA (T<Tg, 100- 150°C) | 185 -189 µm/m – °C | |
| Dielectric Constant | ASTM D150-98 | |
| 60 Hz | 3.9-4.1 | |
| 1KHz | 3.7-3.9 | |
| 1MHz | 3.4 – 3.5 | |
| Dielectric Strength | 16.3 kV/mm | ASTM D149-97A |
| Index of Radiation | 1.512 – 1.515 | ASTM D542 |
Durable Concept Models
Watershed Applications
|
||
| Physical Properties | ||
| Colour | Water Clear | |
| Type | Simulates ABS – Water Resistant |
|
| Mechanical Properties | ||
| Flexural Strength | 63.1 – 74.2 (MPa) | Test/ISO: ATSM D790M |
| Flexural Modulus | 2,040 – 2,370 (MPa) | Test/ISO: ATSM D790M |
| Tensile Modulus | 2,650 – 2,880 (MPa) | Test/ISO: ATSM D638M |
| Tensile Strength | 47.1 – 53.6 (MPa) | Test/ISO: ATSM D638M |
| Impact Strength | 0.2 – 0.3 J/m | Test/ISO: ATSM D256A |
| Elongation Break (%) | 11-20% | Test/ISO:ATSM D638M |
| Water Absorption | 0.35% | Test/ISO: ASTM D570-98 |
| Thermal & Scientific Properties | ||
| Glass Transition Temperature | 39 – 46°C | Test/ISO: E1545-00 |
| Heat Deflection Temp. (°C) @0.46 MPA | 45.9 – 54.5°C | Test/ISO: ATSM D648 |
| Heat Deflection Temp. (°C): @1.81 MPA | 49 – 49.7°C | Test/ISO: ATSM D648 |
| Co-efficient of Thermal Expansion: TMA (<Tg, -40 – 0°C) | 66 – 67 µm/m – °C | Test/ISO: ASTM E831-93 |
| Co-efficient of Thermal Expansion: TMA (T<Tg, 0- 50°C) | 90 – 96 µm/m – °C | Test/ISO: ASTM E831-93 |
| Co-efficient of Thermal Expansion: TMA (T<Tg, 50- 100°C) | 170 – 189 µm/m – °C | Test/ISO: ASTM E831-93 |
| Co-efficient of Thermal Expansion: TMA (T<Tg, 100- 150°C) | 185 -189 µm/m – °C | Test/ISO: ASTM E831-93 |
| Dielectric Constant: 60 Hz | 3.9-4.1 | Test/ISO: ASTM D150-98 |
| Dielectric Constant: 1KHz | 3.7-3.9 | Test/ISO: ASTM D150-98 |
| Dielectric Constant: 1MHz | 3.4 – 3.5 | Test/ISO: ASTM D150-98 |
| Dielectric Strength | 16.3 kV/mm | Test/ISO: ASTM D149-97A |
| Index of Radiation | 1.512 – 1.515 | Test/ISO: ASTM D542 |
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